Why SkyWater Technology, Inc. (SKYT) Outpaced the Stock Market Today - Yahoo Finance Singapore

Creates the Only Vertically Integrated Full-Stack Quantum Platform CompanyAccelerates IonQ’s Fault-Tolerant Quantum Computing Roadmap Facilitates Secure End-to-End Design through Delivery of IonQ’s Platform of Next-Generation Quantum Computing, Quantum Networking, Quantum Security, and Quantum Sensing TechnologiesSkyWater Will Continue to Serve Customers as a U. S.-based Semiconductor FoundryCOLLEGE PARK, Md. & BLOOMINGTON, Minn.-- July 31, 2026 -- IonQ (NYSE: IONQ), the world’s leading quantum platform company, today completed its acquisition of SkyWater Technology (NASDAQ: SKYT), the largest exclusively U. S.-based semiconductor foundry. “Acquiring SkyWater crystalizes IonQ’s vision to serve as a technology leader, merchant supplier and ecosystem enabler across the entire quantum industry. We are investing in capabilities from quantum foundry and advanced packaging to manufacturing and commercialization that the quantum ecosystem requires for future growth,” said Niccolo de Masi, Chairman and Chief Executive Officer of IonQ.

Trapped-ion quantum hardware developer IonQ (NYSE: IONQ) has secured final regulatory approval to finalize its acquisition of SkyWater Technology (NASDAQ: SKYT), the largest exclusively U. S.-based semiconductor foundry. First announced as a definitive $1.8 billion cash-and-stock transaction in January 2026, the deal is set to close on July 31, 2026. Following transaction completion, SkyWater will operate as a wholly owned subsidiary under its existing brand, maintaining its commercial pure-play foundry model while providing IonQ with embedded, dedicated fabrication lines. The combined entity will hold its Q2 2026 financial earnings call on August 5, 2026, followed by an investor day scheduled for September 8, 2026. By acquiring a DMEA Category 1A Trusted Foundry, IonQ becomes the industry’s first vertically integrated, full-stack quantum platform company with direct control over design, wafer fabrication, advanced packaging, and system integration under a single domestic infrastructure.