IBM and Siemens collaborate to advance 3D nanostack technology - Engineering.com
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The companies will develop virtual models, simulation and lithography techniques to address fabrication challenges and prepare the architecture for production.
IBM announced new research aimed at advancing IBM’s nanostack architecture, a new transistor architecture unveiled by IBM earlier this year. The collaboration will bring together IBM’s leadership in semiconductor device innovation and Siemens’ expertise in electronic design automation (EDA), process simulation, lithography optimization, and advanced manufacturing software to accelerate the development of nanostack.
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